The Creating Helpful Incentives to Produce Semiconductors and Science Act of 2022 (CHIPS Act) in the United States, which has completed its first year as law, offers valuable lessons for India''s semiconductor strategy. As industrial policies become increasingly significant for nation-states, the CHIPS Act exemplifies the essential capabilities and structures required for successful implementation.
Four crucial lessons for India to enhance its semiconductor strategy, drawing insights from the CHIPS Act.
Coordinated Government Efforts and Multi-Agency Approach:
Workforce Development and Collaborative Initiatives:
Enhancing Accountability and Transparency:
Investing in Future Research and Innovation:
The CHIPS Act serves as a valuable template for effective industrial policy in the semiconductor sector. By closely examining the administrative framework of the Act, India''s semiconductor strategists can draw inspiration to refine their approach. Coordinated government efforts, workforce development, accountability, transparency, and future research are key components that India should adopt to strengthen its semiconductor strategy. By implementing these lessons, India can ensure the continuity and success of its semiconductor policy, contributing to its technological advancement and global competitiveness.
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India Semiconductor Mission Launched in 2021 under the Ministry of Electronics and IT (MeitY) umbrella, the India Semiconductor Mission (ISM) marks a significant stride with an allocation of Rs76,000 crore. This comprehensive initiative is dedicated to fostering a sustainable semiconductor and display ecosystem within the country. Objectives of ISM are as under:
Mission Components: Semiconductor Fab Establishment Scheme: This component offers fiscal incentives to eligible entities embarking on the establishment of Semiconductor Fabs. The objective is to lure substantial investments toward the creation of semiconductor wafer fabrication facilities within India. Display Fab Establishment Scheme: ISM extends fiscal support to qualified applicants for the creation of Display Fabs. This facet is strategically designed to attract significant investments toward the development of TFT LCD / AMOLED-based display fabrication facilities in the nation. Compound Semiconductors / Silicon Photonics / Sensors Fab and Semiconductor Assembly, Testing, Marking, and Packaging (ATMP) Scheme: With a comprehensive approach, this scheme offers a substantial fiscal boost of 30% of the Capital Expenditure. It targets Compound Semiconductors, Silicon Photonics (SiPh), Sensors (including MEMS) Fab, and Semiconductor Assembly, Testing, Marking, and Packaging (ATMP) facilities within India. Design Linked Incentive (DLI) Scheme: This innovative scheme offers financial incentives and design infrastructure support across various developmental phases of semiconductor design. It encompasses Integrated Circuits (ICs), Chipsets, Systems on Chips (SoCs), Systems & IP Cores, and semiconductor-linked design. |